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Photosensitive Polyimides: Fine-Feature Patterning via Photolithography without Additional Photoresist Layers
Potosensitive polyimide (PSPI) combines the intrinsic thermal stability, mechanical strength, and electrical insulation of polyimide with direct photopatterning capability. It enables fine-feature patterning through standard photolithography without the need for additional photoresist layers, reducing process complexity and improving manufacturing efficiency.
We are developing PSPI solutions with reliable supply and flexible formulation options to meet diverse process and application requirements, supporting advanced semiconductor packaging, wafer-level processing, and printed electronics.
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