Polyimide is widely recognized for its excellent thermal stability (up to 300°C), mechanical flexibility, low moisture absorption, low dielectric constant (ε), and low dielectric loss (ε′). These properties make it an ideal dielectric material for advanced applications, including 5G communications, microwave systems, and low-loss, weather-resistant RF transceiver modules.

​

In addition, these high-performance insulating polymers are well suited for use in the aerospace and automotive industries, where highly stable and reliable printed circuit boards (PCBs) and conductor insulation layers are required. They are also applicable as insulating materials in power electronics, particularly in high-frequency transformer systems.

 

However, conventional polyimide dielectric materials are typically limited by relatively high dielectric loss (Df ≥ 0.01), restricting their use primarily to 4G frequency bands. To meet the demands of 5G high-frequency and high-speed signal transmission, the dielectric loss must be reduced to below 0.004–0.002.

​

To address this challenge, a common approach is to design polymers that incorporate a liquid crystal polymer (LCP)-like structure, introducing rigid, long-chain molecular segments into the backbone. This strategy enhances solubility and improves film-forming properties, while simultaneously delivering excellent electrical performance, thermal stability, and heat resistance. The resulting low dielectric constant enables faster signal transmission, while low moisture absorption and high dimensional stability ensure reliable performance even under elevated temperatures.

​​

​​​​​​​​​​